This wafer level chip size package (WL-CSP) process encases the die in a soliddie-size glass shell.
圆片级芯片尺寸封装(WL-CSP)工艺是在固态芯片尺寸玻璃外壳中装入芯片。
2
The ageing strengthening of semi soliddie castings is more significant than that of liquid die castings for …
这主要是由于半固态压铸件比液压件具有更加致密 ,且为球状的非树枝晶组织。
3
Computer simulation was employed to optimize filling system to predict filling process and prevent the defects for al alloy automotive parts in semi-soliddie casting.