英语词汇small outline package怎么读，是什么意思，单词翻译、读音、固定搭配用法和短语词组及例句-英汉双解词典

简明释义

小外形封装：小外形封装（Small Outline Package，简称SOP）是一种表面贴装集成电路（IC）封装，其占用的面积比等效的直插式封装（DIP）小约30-50%，厚度通常小约70%。它们通常具有与其对应的DIP IC相同的引脚排列。命名封装的惯例是SOIC或SO后跟引脚数。例如，一个14引脚的4011型号将被封装在SOIC-14或SO-14封装中。

专业释义

1
电子、通信与自动控制技术
- 小型外壳
2
计算机科学技术
- 小轮廓包

双语例句

1
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
2
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
3
The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.
该器件提供两种封装：24引脚、0.3英寸宽、塑料密封双列直插式封装(DIP)和24引脚小形集成封装(SOIC)。

单词	small outline package
释义	small outline package 美/ sm??l ?a?tla?n ?p?k?d? / 简明释义小外形封装：小外形封装（Small Outline Package，简称SOP）是一种表面贴装集成电路（IC）封装，其占用的面积比等效的直插式封装（DIP）小约30-50%，厚度通常小约70%。它们通常具有与其对应的DIP IC相同的引脚排列。命名封装的惯例是SOIC或SO后跟引脚数。例如，一个14引脚的4011型号将被封装在SOIC-14或SO-14封装中。专业释义 1 电子、通信与自动控制技术小型外壳 2 计算机科学技术小轮廓包双语例句 1 The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)." AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。 2 The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium. 小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。 3 The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package. 该器件提供两种封装：24引脚、0.3英寸宽、塑料密封双列直插式封装(DIP)和24引脚小形集成封装(SOIC)。
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