The wire sawing process has been applied to slice single silicon into thin wafers for its character of minimum warp, uniform thickness and low kerf loss.
由于线锯切割具有切片薄、表面翘曲变形小、厚薄均匀和切口损失小等优点，被广泛用于单晶硅切片加工。
2
There was mass loss of silicon rubber after proton radiation and the mass loss percent increased with the increase of irradiation fluence.
质子辐照后，硅橡胶的质量有所损失，其质损率随辐照能量和剂量的增加而增加；
3
The main transformer uses imported quality cool - rolled silicon - steel plate cores , less power loss and small idle current.