The System can accomplish analyzing and identifying 3-d measurement error coming form machine tools and semiconductormanufacturingequipment in hours.
该系统可在几小时内完成机床和半导体制造设备的三维空间误差评估。
2
The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductormanufacturingequipment.
To do all this, you are probably going to need chip-manufacturing machines from Applied Materials, one of the main suppliers of such equipment to the semiconductor industry.