Through appearance testing, X-Ray testing and temperaturecyclingtesting, the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.
通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
2
RDP transducers are subjected to temperaturecycling as well as electrical supply cycling, plus shock and vibration testing where application circumstances demand. RDP.