The results showed that reducing thiols concentration can reduce specificsurfaceenergy, so as to enhance transfer efficiency and spreading effect of ink on substrate surface.
结果表明:降低硫醇浓度可降低其比表面能,从而增大转移率和增强在基底表面的铺展效果。
2
The important factors influencing the gaps closing include the gap height, the spatial wavelength, the specificsurfaceenergy of adhesion, the material deformability and the silicon wafer thickness.