Research progress of lead-free solder, invalidation models of solderjoint, solderjoint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
2
The welding quality of the solderjoint on the conducting wire connected with the soldering cover and the PCB.
导线在接插件焊杯内的焊点和导线在印制板上的焊点的焊接质量。
3
Through non-linear finite analysis , the dependence of fatigue life of solderjoint on thermomechanical properties of underfill was calculated.