Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.
它的广泛报导集中在印刷电路、集成电路、连接材料、半导体、导线、粘结、钎焊、焊锡和焊接。
2
Stranded conductors shall not be consolidated by soldering where they are subjected to contact pressure, unless the contact pressure is provided by spring terminals.
多股导线在其承受接触压力之处，不应使用钎焊将其焊在一起，除非由弹簧接线端子提供接触压力。
3
Conductors of supply cords shall not be consolidated by soldering where they are subjected to contact pressure, unless the contact pressure is provided by spring terminals.