The manufacture of solderbump is one of the key technologies for area array packaging (AAP).
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。
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Research status of laser reflow on solderbump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.