Provided is a surface mounting component wherein a shock applied to constitution members in manufacturing process is reduced and sufficient solder bonding strength is achieved after surface mounting.

The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.

The solder alloy of the invention is suited to bonding oxides together and the oxides preferably comprise glass.