释义 |
- n.锯切
- v.锯开;锯断(saw 的 ing 形式)
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能源科学技术 锯切 Improving fixing precision of the diamond blade to make it flat and uniform can reduce the surface damage sliced. Wire sawing is a new kind of wafer slicing method. 内圆切割具有切片精度高、径向和晶片厚度方向调整方便、加工成本低等优点,改进装刀方法,提高刀片的安装精度,可刀片受力均匀,有效减小锯切损伤程度。
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