The simulation results reflect the microscopic process such as grain contact, sinteringneck growth and pore spheroidization.
模拟结果反映了颗粒间接触,烧结颈生长和气孔球化的微观过程。
2
The predicted growth rate of sinteringneck and sintering rate for different ratios of grain boundary to surface mobility are consistent with the existing theoretical analysis.
量化计算烧结颈生长率以及在不同晶界和表面迁移率比值时的烧结率,较好地符合理论分析的趋势。
3
The invention takes method of infiltering copper during sintering green compact at high temperature to enhance the neck strength.