The method comprises a step of removing a thin slice of the integrated circuit chip from part of the thickness along the direction vertical to the structure length.
所述方法包括以沿垂直于所述结构长度的方向的方式从所述厚度 的部分去除一所述集成电路芯片的薄片。
2
The PZT ferroelectric slice sample was measured by the system with the automatic voltage-decaying circuit, and hysteresis loops of the sample was exhibited.
利用配有电压自动衰减电路的铁电材料测试系统测量了PZT铁电体材料样品的电滞回线。
3
It is achieved the function by feedback, integral circuit, computerisation data acquisition and numeral control with the computer on slice, and provided favourable dynamic and static performance.