The complexity of IC increases, the feature and spacingdimension in the design become smaller.
集成电路的复杂度越来越高，最小线宽和最小间距变得越来越小。
2
Influence of pile spacing, pile cap dimension and Angle of internal friction of embankment filling on the pile efficacy is analyzed.
研究了桩间距、桩帽大小和填料内摩擦角对桩体荷载分担比的影响。
3
The re-bar binding should be executed according to the requirements of the drawing. All specification, dimension, quantity and spacing should be checked correct.