Broadly speaking, the embodiments of the present invention provide an improved plasma processing mechanism, apparatus, and method to increase the processuniformity at the very edge of the substrate.
大体而言，本发明的实施例提供了改进的等离子处理机构、设备和方法以提高基片边缘处的处理均匀性。
2
That process increases uniformity, eventually to the level the universe began with.
这一过程增加了宇宙的均匀性，并最终使其达到宇宙诞生时的水平。
3
Now, in 9.5 there is uniformity in the process model of DB2 as EDUs are now thread based on Linux, UNIX, and Windows environments.