The characteristic of thermosetting polyphenyleneoxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.
论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。
2
Include polyoxymethylene, polyamide, polycarbonate, ABS, polyphenyleneoxide, polyethylene terephthalate, polysulfone, polyether sulfone, polyimide, polyphenylene sulfide and so on.
Polyphenyleneoxide was successfully added to phenolic resin during the syn- thesis process by using a modifying agent XPY, and a new modified environmental phenolic plastic was made.