Wafer transfer apparatus and wafer polishingapparatus, and method for manufacturing wafer.
Jiro Kajiwara： 晶片传送装置和晶片研磨装置，以及晶片的制造方法。
2
A new precision apparatus which the polishing force can be controlled has been designed and developed. The apparatus has equipped with micro adjustment and display function module to polishing force.
本文设计并研制了一套可控制抛光作用力的精密抛光装置，该装置具有抛光作用力微调功能及显示功能。
3
This liquid magnetic grinding apparatuspolishing technology is a new polishing technology applying the rheologic property of grinding apparatus.