英语词汇pressure-sensitive adhesive怎么读，是什么意思，单词翻译、读音、固定搭配用法和短语词组及例句-英汉双解词典

短语

1
Expansion extrusion molding, extrusion molding apparatus therefor, and process for producing pressure-sensitive adhesive sheet.
膨胀挤出模塑，采用该法的挤出模塑装置，及用于制备压敏粘合剂片材的方法。
2
Biaxially oriented polypropylene film (BOPP) as the base material, made of packing tape coated with pressure-sensitive adhesive.
以双向拉伸聚丙烯薄膜(BOPP)为基材，涂压敏胶制成包装胶带。
3
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。

单词	pressure-sensitive adhesive
释义	pressure-sensitive adhesive 简明释义压合胶粘剂压敏粘合剂网络释义短语 1 pressure sensitive adhesive 压敏胶 ; 胶粘压敏胶粘剂 2 pressure sensitive adhesive tape 压敏胶粘带 ; 轻压粘着带 ; 压敏胶黏带 3 Pressure-sensitive Adhesive Tape 压敏胶带 ; 压敏胶粘带双语例句 1 Expansion extrusion molding, extrusion molding apparatus therefor, and process for producing pressure-sensitive adhesive sheet. 膨胀挤出模塑，采用该法的挤出模塑装置，及用于制备压敏粘合剂片材的方法。 2 Biaxially oriented polypropylene film (BOPP) as the base material, made of packing tape coated with pressure-sensitive adhesive. 以双向拉伸聚丙烯薄膜(BOPP)为基材，涂压敏胶制成包装胶带。 3 Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet. 半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
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