In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
文章对Q FN器件的焊盘设计,网板设计及组装工艺作了详细的介绍。
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Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.