Finally, the bonding strength of IC resin and wood under hotpressing was tested. The relationship between bonding strength and reaction degree was analyzed.
论文最后对异氰酸酯热压胶接木材的强度与反应程度之间的关系作了初步研究。
2
The results show that interface element diffusion and reaction on interface in vacuum hot-pressing sintering processing improved interface strength. Fracture occurred mainly in Al matrix.
结果表明，真空烧结过程中出现了界面反应，改善了界面结合强度，断裂破坏主要在基体上进行。
3
Hotpressing can facilitate the integrality of reaction and the crystalline structure, but will induce the grain growth.