With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
2
A new method for measuring bonding strength between electroplated layer and substrate of diamond tool is proposed.
提出一种新的电镀金刚石工具镀层与基体结合强度测试方法。
3
Men see the telephone as a communication tool for sending facts and information to other people, but a woman sees it as a means of bonding.