An element bondingparameter topological index HLA is proposed based on topological principle and valence shell electron structural character.
基于元素键参数拓扑指数原理以及镧系元素价层电子结构特征构建了一种新的拓扑指数HLA。
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It is deduced from the bondingparameter topological index he that a quantitative relationship must be existed between he and the thermal decomposition temperature of some sulfates.
As the demand increasing steadily for small volume, high density and high heat-dissipation rate IC, the key parameter of wire bonding — pad pitch has to shrink in accordance.