The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays.
减少元件和电路的几何尺寸，以达到增加电路的封装密度、减少功耗和减小信号传播延迟的目的。
2
The oxidation degree of grain boundaries and crack propagation are qualitatively analyzed based on crack density and percentage of intergranular crack.
用裂纹密度和晶界裂纹的比例对晶界氧化的程度及裂纹扩展情况定性地加以分析。
3
The coherence bandwidth of shortwave channel is calculated by using the density profile and wave propagation features in ionosphere.