A new physical model for on-chipinterconnecton high lossy substrate is proposed based on complex image theory and PEEC.
针对高损耗衬底,基于复镜像理论,结合部分元等效电路法,建立了一种新的片上互连线物理模型。
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The design and implementation of high speed low power VLSI structure and the analysis and design of high performance on-chipinterconnect are two key fields of VLSI design.