With the increase of chip integration level and packagingdensity, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。
2
Shockproof packaging can be compared with the cutting, forming; due to greater difference in density can also have a wider range of uses.
相对于防震包装可以切割、成型；因密度差异较大，还可以有更为广泛的用途。
3
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.