The package construction, process flow, and packagereliability are described, together with board level assembly processes and interconnect reliability.
论述了封装结构、工艺流程及封装可靠性，并阐述了板级组装工艺过程和互连可靠性。
2
The new DDI package improves thermal heat dissipation by 20 percent over a conventional COF package, allowing the DDI to last longer and operate with greater reliability.
It improves the reliability of sheathing bag and solves the problem of rubber automatic package by adopting the automatic lengthening and shortening longue-like plate.