The CPU contains thousands of transistors and logic circuits packaged in a very small design known as an integrated circuit (IC).
CPU包含成千上万个晶体管和逻辑电路，它们被封装在一个很小的设计空间模式，称为集成电路(IC)。
2
The principle and structure design of temperature compensation package for FBGs are expatiated, temperature characteristic of packaged FBGs is measured.
阐述了温度补偿封装技术的基本原理和结构设计方法，并对封装后的光栅作了温度性能测试。
3
The cushioning design sensitivity for nonlinear multi degrees of freedom packaged structures is at first analyzed in this paper.