The heat sink is in thermal contact with the integrated circuitpackage to extract heat during operation.
散热片与集成电路封装热接触用于在工作过程中提取热量。
2
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
3
If the package resonant modes right within the operation frequencies range of the enclosed circuit, coupling between the circuit and these resonant cavity modes may disturb circuit operation.