There are also some micropores and microcracks in the reflowed alloy.
在回流焊形成的合金层中也有一些微孔和裂缝。
2
Then, the solder is reflowed to bond the first and second posts, and the mother device wafer is diced.
接着，使所述焊料回流以接合所述多个第一柱和所 述多个第二柱，并且切割所述母器件晶片。
3
When solder bumps (22) on the die are reflowed, the fluxing agent ACTS to remove any oxides present on the solderable surfaces of the substrate or the die.