The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a patternmetal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
2
The patternmetal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
3
Metal with low carbon level is soft unlike metal that contains much carbon. In forging the two kinds of metal are mixed forming the most beautiful pattern.