Wire bonding method, semiconductor device, capillary for wire bonding and ballbump forming method.
丝焊方法，半导体器件，丝焊的毛细管及球块形成方法。
2
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
Thirdly, a learning method based on Locally Weighted Regression is proposed to forecast the motion of the ball, especially after the ballbump into wall.