After each stage of the etching process a fixed depth of this is dissolved away, exposing a different part of the circuit to the etching chemicals.
在蚀刻技术的每个阶段，固定高度的阻材料层会消失，暴露出不同部分的电路进行化学物质的侵蚀。
2
If, once in the developing afteretching, anti etch removal is not clean, can cause a short-circuit defect.
如果，一旦于显影后蚀刻前，出现抗蚀刻剂去除不净，会导致短路缺陷的发生。
3
Afteretching the surface of GaAs chip could be smooth and the isolation grooves have little edges, which can completely meet the requirements of device design.