Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductordevice and manufacturing method for the same.
金属还原方法，多层互连结构及制法，半导体器件及制法。
2
A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces.
一种用于半导体发光器件的安装基板包括具有第一和第二相对金属表面的固体金属块。
3
A semiconductordevice (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).