The utility model relates to a chip materialtray supplying device, which comprises a first carrier drive part, a second carrier drive part and a chip taking-putting head.
本实用新型为一种芯片料盘供应装置,包括:一第一载台驱动部、一第二载 台驱动部以及一芯片取放头。
2
The chip taking-putting head can take a chip on a wafer and selectively position the chip on the first materialtray or the second materialtray according to the chip grade.