Black oxidation technology for copper in multilayerprintedcircuitboard was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
2
The fabrication procedure of two kinds of microwave multilayerprintedcircuitboard filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
3
The resistance of the copper rate is low, so in printedcircuitboard, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.