This paper describes the formation of double side and multilayercircuit, and embedded passive component using high function thick film printing technology.
概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
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Multilayer co-fired AlN ceramic is a type of high performance ceramic that is printed in thick film to form multilayercircuit and fired in a certain atmosphere in high temperature.
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.