Today, all developments regarding rigid-multilayerboard have been implemented to rigid-flex printed circuit boards.
今天，凡是在刚性多层板的技术进步，同样，在刚-挠性印制板也是能够实现的。
2
Best layout and performance are achieved with at least a 4-layer multilayerboard, where there is a ground plane layer, a power supply layer, and two signal layers.
电路板至少需要4层才能实现最佳布局和性能：一个接地层、一个电源层和两个信号层。
3
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.