To effectively reduce the injection-machine mould-board weight, sequential optimization design method starting from high level topology optimization to low level parameter optimization was proposed.
为了有效地降低注塑机模板的重量，提出了从高层次拓扑优化到底层次参数化优化的顺序优化设计方法。
2
Apply to: apply to: acid electroplated copper electric circuit board electroforming mould and electroplating for printing plate making etc.
适用于：酸性电镀铜、线路板、电铸模、制版电镀等。
3
Researched software development techniques based on UG, and established mouldboard parametric model and parametric drive mechanism.