This paper introduces the necessity of double beam splitting system applicating in polarization interference phase subdivision and the optimized principle of this beam splitting system.

By splitting a laser beam and aiming each part onto opposite sides of a polished silicon wafer, the group engineered a system of reflection and interference that traps both beams in the silicon.

A new vision on the fly system is proposed based on the beam splitting lens according to the demand of component picking and placing in the electronic manufacturing equipments.