The over-moldedpackage, holds together a samarium cobalt pellet, a pole piece and a true zero-speed Hall IC that has been optimized to the magnetic circuit.
在超模压封装,拥有一个共同钐钴颗粒,极片和一个真正的零速霍尔IC进行了优化的磁路。
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The surface of the moldedpackage is textured when it is removed from the mold. The pin cavities are often very smooth as you can see in the previous picture.
The device consists of a single-shot molded plastic package that includes a samarium cobalt pellet, a pole piece , and a Hall effect IC that has been optimized to the magnetic circuit.