A stable recursive algorithm is presented for the transient simulation of interconnect systems in the high-speed VLSI and multichipmodules (MCMs).
本文提出了一种用于求解高速VLSI和多芯片组件(MCM)中有耗互连线瞬态响应的稳定递归算法。
2
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichipmodules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
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This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichipmodules and microelectronics mechanical systems.