This paper presented a new method for multichipmodule routing.
对多芯片组件的布线方法提出了一种新的方法。
2
In 3d-mcm (multichipmodule) packaging designs, heat dissipation is one of the key issues that must be solved.
在3d - MCM(多芯片组件)封装设计中,大功率和高热流密度导致系统的散热成为关键技术之一。
3
The essay expounds a practical RFID system. The devise adopt the multi-pro IC chip S6700 produced by TI, MCU PIC16F877 and power magnifier module to realize long distance RFID system.