To lower temperature sintering is desired for the fabrication of multiplayer microwaveceramics.
为满足多层微波元件低温烧结的需求，必须降低微波介质陶瓷的烧结温度。
2
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
3
The latest development on microwave processing of non-oxide ceramics was introduced.