Research progresses of laser trimming, laser drilling, laser cleaning, laser flexible routing and lasermicrowelding applied in the IC fabrication and packaging are given.
介绍了在集成电路制造封装中采用的激光微调、激光打孔、激光清洗、激光柔性布线和激光微焊技术。
2
The Welding Technology of lower power pulse YAG laser beam weldingmicro-module with filler wire was given.