The structures of the invention are prepared by adhering a porous dielectric layerto a substantially nonporous capping layer via an intermediate adhesion promoting dielectric layer.
通过将多孔介电层经中间的增粘介电层粘合到基本上无孔的贴面层上来制备本发明的结构。
2
This product is coated with a tacky residue-free adhesive on the surface of each layerto attract dirt seeds and a high tack adhesive on the bottom layer for maximum adhesionto the substrate.
该产品每层外测涂有无残留物的粘胶剂，吸附环境中的粉尘；底面又涂有高粘度的粘胶剂，黏附于各种表面。
3
EG help to promote the formation of carbon layer, while the addition of APP to the combustion of PVA has a certain viscosity, increasing the adhesion of carbon layer.