Ionsputtering yields on t? Ti target are numerically calculated with TRIM program.
应用TRIM程序模拟了离子在氚钛靶上的溅射产额。
2
However, the predominant process of secondary ionsputtering is kinetic sputtering, which closely related to the momentum deposition on the target surface (nuclear stopping power).
而主导二次离子溅射的过程是动能溅射，它与靶表面的动量沉积(核能损)过程密切相关。
3
The electronic circuitry of the various vacuum protection schemes, which use sputteringion pump or cold-cathode or hot cathode ionization gauge as sensors, was compared.