This paper deals with method of soldering thermoelectric cooler with metal dewar of infrared detector.
本文论述了四级微型半导体致冷器与红外探测器金属杜瓦瓶的钎焊方法。
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Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.