Upon the installation of a multi beam laserdicing system, the obviously advantages of using such a laserdicing process become evident.
基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。
2
The higher speed of dicing has led to a productivity increase of 5 – 8 times, compared with any other conventional separation system, 3- 5 times any other laserdicing concept.
较高的刻线速度提高了产能，与其他常规方式大概提高了5-8倍，与其他激光方式提高了3-5倍。
3
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.