The real contact area of the bond interface and the cross-sectional deformation of the bond wire were the causations respectively for the fluctuation and wholly increase of the resistance.
接头界面有效连接面积和接头上引线横截面变形量的变化分别是造成接头电阻波动性和整体增大趋势的原因。
2
The thermal interface material provided by the invention has the characteristics of low thermal contactresistance and high heat-conducting efficiency.
本发明提供的热界面材料具有接触热阻小，导热率高的特点。
3
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interfacecontact between the electrode and ceramic.