In the paper, mechanicallapping was used for lapping thick CVD diamond and the lapping rate was 6.
本文采用了机械研磨法来研磨CVD金刚石厚膜,研磨速率达6。
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The mechanism of W-CMP was analyzed, the slurry makes a dual function of chemical erosion and mechanicallapping, has an important influence on the polishing rate.
Vibration of lapping machine is an important influencing factor on the lapping quality of diamond cutting tools in mechanicallapping, especially in the precision lapping process.